What material can be micromachined with femto-second laser technology ?

Femtosecond lasers exhibit broader adaptability to various materials, including high-hardness, high-brittleness, and transparent materials that are difficult to process with conventional methods. We optimize laser wavelength, pulse energy, scanning speed, and other parameters based on the optical, physical, and chemical properties of the materials to achieve efficient and high-precision processing.

Processable materials include:

1. Metals and Alloys:
   
   Covering stainless steel, titanium alloys, copper/brass/bronze, tungsten carbide, nitinol, precious metals (palladium, iridium), hardened steel, etc. In the aerospace field, it can complete thermal-deformation-free cutting of thin-walled components; in the medical field, it realizes the micro-structuring of implants (e.g., burr-free processing of nitinol stents); in electronic devices, it etches conductive traces without damaging conductivity.
   
   

2. Plastics and Polymers:
   
   Including PET, PBT, BICOR, COC, PDMS, etc. Suitable for processing micro-electromechanical systems (MEMS) structural components, such as precision forming of micro-gears and micropumps; it can also be used for micro-channel design of biodegradable carriers, avoiding high-temperature melting deformation in traditional processing.
   
   

3. Ceramics and Hard-Brittle Materials:
   
   Including zirconia, silicon nitride (Si₃N₄), silicon carbide (SiC), hard ceramics, photonic ceramics (Photoveel IIs), etc. In the electronic packaging field, it can perform precise drilling of ceramic housings; in ceramic tool processing, it realizes edge strengthening, effectively suppressing chipping and micro-cracking during the processing of brittle materials.
   
   

4. Transparent Materials:
   
   Quartz glass, sapphire, ruby, optical glass, etc., are all applicable. Typical applications include drilling inside optical fiber connectors and etching micron-scale channels in microfluidic chips.
   
   

5. Composite Materials and Special Substrates:
   Carbon fiber-reinforced polymers (CFRP), metal matrix composites, PCB laminates, metal paint, IMS multi-substrates, etc. In electronic substrate processing, it realizes through-hole formation while avoiding thermal stress damage at the interfaces of different materials.
   
   

6. Biological and Functional Materials:
   Including biocompatible metals (titanium alloys, nitinol), medical polymers, superconducting films, piezoelectric ceramics, etc.