Applications
Serving as the functional heart of laptops, desktops, and smartphones, semiconductors are now undergoing an exponential reduction in size as consumer electronics and intelligent devices trend toward lighter, thinner, and more compact forms. This evolution demands manufacturing processes with higher efficiency, ultra-fast speed, and nanometer-level precision.laser technology has emerged as a critical enabler for pushing dimensional limits. Laser micromachining stands out for its non-contact processing, minimal heat-affected zone (HAZ＜1μm), and sub-micron accuracy, enabling complex structuring on millimeter-scale chips and micron-level electronic materials.
Advantages
Femtosecond laser refers to the ultra-short pulse laser with a pulse duration at the femtosecond scale, boasting numerous processing advantages in the semiconductor field:
1. Ultra-precise Machining：Achieves nanometer-level processing, breaking through the limits of traditional techniques to adapt to the development needs of smaller and more integrated semiconductor devices.
2. Minimal Thermal Influence：With remarkable "cold processing" characteristics, it minimizes the heat-affected zone, avoiding material deformation and damage caused by thermal effects in traditional machining.
3. Wide Material Adaptability：Capable of processing various materials like silicon-based, glass, and ceramics, facilitating the integration of semiconductors with heterogeneous materials and expanding application scenarios.
4. Superior Machining Quality：Creates smooth, burr-free surfaces without thermal damage layers, enhancing the reliability and service life of semiconductor devices.
5. Nondestructive Testing Advantage：Precisely detects internal defects and impurities by analyzing the signal from laser-material interaction, ensuring chip quality.
6. Strong 3D Machining Capability：Breaks through traditional limitations, enabling the processing of complex 3D structures (such as semiconductor MEMS) to meet special design requirements.
