PRODUCT

Laser Depaneling Equipment for Consumer Electronics
Mainly used in the electronics industry production of FPC, PCB, aluminium foil, copper foil, chip modules, camera modules, TYPE-C and other precision cutting, cutting sidewalls smooth and no cutting carbonation, with low thermal stress and thermal impact, with cutting, drilling and window function, in line with the loading and unloading mechanism or embedded in the assembly line operation, the independent choice of loading and unloading direction, significantly improve production efficiency, with high efficiency and low cost advantages.
Descriptions

Mainly used in the electronics industry production of FPC, PCB, aluminium foil, copper foil, chip modules, camera modules, TYPE-C and other precision cutting, cutting sidewalls smooth and no cutting carbonation, with low thermal stress and thermal impact, with cutting, drilling and window function, in line with the loading and unloading mechanism or embedded in the assembly line operation, the independent choice of the direction of loading and unloading, significantly improve production efficiency. It has the advantages of high efficiency and low cost.


Feature

High-performance laser with good beam quality and controllable power to meet the demand for high-quality clean cutting;


Professional cutting vision control system, compatible with different plate variability, to achieve batch control of cutting quality;


Compact structural design of online equipment, compact size, easy to embed all kinds of online production.



Specification
    Technical parametersModel number
    LasersFemtosecond laser
    Centre wavelength355nm/532nm
    Laser power15W/20W/25W/35w/50w
    Scanning range of galvanometer42mm*42mm
    CCD field of view range4mm*6mm
    Working surface350mm*350mm/300mm*400mm
    Thickness of processed material≤2.0mm
    Repeat Positioning Accuracy≤±0.02mm
    Comprehensive cutting accuracy≤±0.03mm


Showcase
FAQ

more+What material can be micromachined with femto-second laser technology ?

    Femtosecond lasers exhibit broader adaptability to various materials, including high-hardness, high-brittleness, and transparent materials that are difficult to process with conventional methods. We optimize laser wavelength, pulse energy, scanning speed, and other parameters based on the optical, physical, and chemical properties of the materials to achieve efficient and high-precision processing.Processable materials include:Metals and Alloys:Covering stainless steel, titanium alloys, copper/brass/bronze, tungsten carbide, nitinol, precious metals (palladium, iridium), hardened steel, etc. I...

more+What are the micro-machining capabilities of femotosecond laser technology?

    Diameter/ Dimensions down to 20 µm or less;Size tolerances < 1µm;Straightholes (no taper);Thickness <2mm;Corner radius < 10µm;Surface quality / Homogeneity of the hole;No damages, no micro cracks;

more+What is a femtosecond laser?

    1, IntroductionFemtosecond (Femtosecond,fs), also known as millimicroseconds, is 10^-15 s. Femtosecond lasers operate in the form of pulses with a duration of only 10-100 fs in general, which is the shortest pulse that can be obtained under the current state of the art. Because of this, once the femtosecond laser was born, it has been widely used in microscopic processes in the fields of physics, biology and chemistry, thus discovering many new ultrafast phenomena.2、FeaturesExtremely short pulse width: Pulse width refers to the duration of time when the laser power is maintained at a certain v...
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  • Prescription
  • Precision Micro-hole Drilling Solutions
  • Carbonless cutting solutions
  • Sub-micron etching solutions
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  • Phone: +8619076121225
  • E-mail: laser_ops@szmono.cn  
  • Add: 1F, Building 1, Chuangxiangdi, Yanxiang Zhigu, Guangming District, Shenzhen, China
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