PRODUCT

Femtosecond laser ultrafine cutting machine
Specialised equipment has been developed for various processing needs (no recast layer, no microcracks, no carbonisation), implantable and interventional cutting of all types of metals and non-metals, biosensors, and cutting of various types of conductive films for detection.
Descriptions

Specialised equipment has been developed for various processing needs (no recast layer, no microcracks, no carbonisation), implantable and interventional cutting of all types of metals and non-metals, biosensors, and cutting of various types of conductive films for detection.


Applied to aerospace, biomedical, semiconductor, consumer electronics and other fields, it is suitable for ultra-thin metal copper foil, aluminium foil, stainless steel foil, nickel alloy foil and other materials micro-fine precision non-destructive processing, as well as flexible PI, PET, glass, silicon substrate precision laser scribing, grooving, etching and other precision processing.




Feature

 Adopting femtosecond laser, ultra-short pulse processing with almost no heat conduction, ultra-fast laser and material action with very small impact force, very small thermal effect, ultra-fine and efficient cold processing mechanism, suitable for high-speed cutting of any organic & inorganic materials;

The cutting surface is neat, burr-free, no recast layer, no micro-cracks and metallurgical defects;

Higher single pulse energy, higher machining accuracy, fine machining of almost any solid material;

Non-selective and stress-free for materials.



Specification
    Technical parametersModel number
    Lasers1030nm/515nm/343nm
    Laser power10w/20W
    Working surface350mm*350mm(Customisable)
    CCD field of view range4mm*6mm
    CCD positioning accuracy±3um @150Megapixel
    XY axis positioning accuracy≤±3um
    X/Y axis repeatability≤±lum
    Input file formatAdjuvantdxf、cad
    Comprehensive cutting accuracy±15um
    Environmental temperature22°C±3°C
    Relative humidity30%~65%, no condensation



Showcase
FAQ

more+What material can be micromachined with femto-second laser technology ?

    Femtosecond lasers exhibit broader adaptability to various materials, including high-hardness, high-brittleness, and transparent materials that are difficult to process with conventional methods. We optimize laser wavelength, pulse energy, scanning speed, and other parameters based on the optical, physical, and chemical properties of the materials to achieve efficient and high-precision processing.Processable materials include:Metals and Alloys:Covering stainless steel, titanium alloys, copper/brass/bronze, tungsten carbide, nitinol, precious metals (palladium, iridium), hardened steel, etc. I...

more+What are the micro-machining capabilities of femotosecond laser technology?

    Diameter/ Dimensions down to 20 µm or less;Size tolerances < 1µm;Straightholes (no taper);Thickness <2mm;Corner radius < 10µm;Surface quality / Homogeneity of the hole;No damages, no micro cracks;

more+What is a femtosecond laser?

    1, IntroductionFemtosecond (Femtosecond,fs), also known as millimicroseconds, is 10^-15 s. Femtosecond lasers operate in the form of pulses with a duration of only 10-100 fs in general, which is the shortest pulse that can be obtained under the current state of the art. Because of this, once the femtosecond laser was born, it has been widely used in microscopic processes in the fields of physics, biology and chemistry, thus discovering many new ultrafast phenomena.2、FeaturesExtremely short pulse width: Pulse width refers to the duration of time when the laser power is maintained at a certain v...
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  • Prescription
  • Precision Micro-hole Drilling Solutions
  • Carbonless cutting solutions
  • Sub-micron etching solutions
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