Femtosecond Laser Precision Drilling in Diamond: When the Sharpest 'Light' Meets the Hardest 'Stone'
Diamond, commonly known as diamond, is the hardest known substance in nature (Mo...
MONO | 2025-06
INDUSTRY
From June 4-7, the 24th China International Mould Technology and Equipment Exhibition (DMC2025) was held at the Shanghai New International Expo Center (Halls W1-W5). Focusing on the two pillars of "mould manufacturing" and "precision equipment," the exhibition accelerates the development of the mould forming industry chain. MONO LASER (Booth No.: W5 A158) debuted its self-developed femtosecond laser micro-nano processing solutions, leveraging disruptive femtosecond laser technology to tackle micro-nano processing challenges in the mould industry.
MONO LASER is committed to becoming a world-class femtosecond laser technology and application enterprise, offering precision mould processing services and femtosecond laser solutions.
Aimed at micro-nano structure processing on roller surfaces, this solution achieves precise etching of complex imprint structures such as micro-bosses, hexagons, hemispheres, and grooves. The process features no thermal diffusion effect, avoiding material deformation and performance degradation caused by traditional methods. Compatible with diverse substrates like metals, ceramics, and composites, it provides long-lasting and durable solutions for imprint molds.
Breaking through the limitations of traditional machining in depth-to-diameter ratio, this solution enables high-efficiency machining of micron-scale microholes with a depth-to-diameter ratio of 10:1. The hole wall roughness is <0.2μm, eliminating the need for secondary polishing. With a single-hole processing cycle reduced to tens of seconds, it significantly enhances production efficiency and consistency for components like cooling channels in injection molds and precision filter elements.
Meeting the high-precision requirements of optical light guide plate molds, the solution forms submicron-scale microstructures such as grooves, crescent shapes, and triangular prisms. The process ensures no molten residue and high surface finish, guaranteeing uniform light efficiency for light guide components and supporting upgrades for high-end products.
Addressing the precision and biosecurity demands of contact lens molds, this solution achieves submicron-scale pattern processing with zero thermal damage. It supports efficient customization and rapid iteration of complex patterns, catering to the flexible manufacturing needs of personalized products in the medical aesthetics and beauty sectors.
1. Technical Advantages:
1. Utilizes high-stability femtosecond lasers (1030/515/343nm) for complex trajectory processing.
2. High-precision positioning: Hole diameter accuracy ±1.5μm, positioning accuracy ±1μm.
2. Core Processing Capabilities:
1. One-step forming of three-dimensional complex-shaped holes (e.g., inclined holes, helical holes, film cooling holes).
2. High-quality hole characteristics: Maximum depth-to-diameter ratio 10:1, hole diameter 0.04mm~2.5mm, with no thermal damage.
1. Technical Advantages:
1. Employs tightly focused femtosecond lasers (1030/515/343nm) with nanoscale focal spots (minimum linewidth ≤0.2μm).
2. High-precision positioning: Positioning accuracy ≤0.3μm, repeat positioning accuracy ≤0.2μm (X/Y/Z axes).
2. Core Processing Capabilities:
1. Achieves nano-scale precision microhole array processing: Minimum hole diameter 200nm (0.0002mm).
2. Compatible with precision materials: Glass, polymers, metal films, etc.
1. Technical Advantages:
1. Equipped with high-stability femtosecond lasers (1030/515/343nm).
2. Supports large-scale processing up to >350mm×350mm with stitching accuracy ≤±1μm.
3. Exceptional precision: Etching accuracy ≤±1μm, minimum etching depth ≤0.1μm.
2. Core Processing Capabilities:
1. Ultra-fine etching of curved and complex surfaces.
2. Wide material compatibility: Metals, non-metals, composites (glass, silicon wafers, alumina ceramics, etc.).
3. Superior processing quality: Surface free of molten residue, roughness Ra<0.2μm, suitable for submicron-scale micro-nano pattern formation.
1. Technical Advantages:
1. Features high-power femtosecond lasers (1030/515/343nm).
2. High-precision cutting: Single-axis minimum positioning accuracy ≤1μm, minimum cutting width ≤3μm (customizable).
3. Large-format stitching capability: Accuracy ≤1μm.
2. Core Processing Capabilities:
1. Micron-level precision cutting of ultra-thin materials (≤0.1mm): e.g., PI films, PET films, silicon wafers.
2. Flawless cutting surface: Roughness Ra<0.4μm, free of recast layers and microcracks.
3. Exceptional material compatibility: Super-hard metals (tungsten steel, tungsten carbide), alloys (titanium alloys, nickel-based alloys), and non-metallic materials.
Mould manufacturing is accelerating toward "precision, miniaturization, and intelligence." As a transformative tool for micro-nano processing, femtosecond laser technology is reshaping industry standards. MONO LASER not only provides professional femtosecond laser equipment but also offers full-cycle technical support from process design and equipment selection to optimization.
During the exhibition (June 4-7), MONO LASER will conduct sample demonstrations and technical consultations at Booth W5 A158, providing one-on-one product upgrade solutions. Industry peers are welcome to visit and explore innovative applications of femtosecond laser technology in mould manufacturing, collaborating to unlock new frontiers in extreme manufacturing.
