Laser perforation facilitates precision machining of microvias and small holes in ultra-thin molybdenum wafers

Molybdenum is widely used in the electronics and semiconductor industries, vacuum equipment and thermal management, aerospace and defence industries, chemical and petroleum industries, medical devices and biomedical applications, optics and optoelectronics due to its high melting point and excellent thermal stability, excellent mechanical properties, chemical inertness, good thermal and electrical conductivity and other excellent properties.

Femtosecond laser cutting and drilling in ultra-thin molybdenum sheets is a high-precision machining technique suitable for the manufacture of microscopic holes and fine microstructures. The extremely short pulses emitted by femtosecond lasers are able to generate localised heating of the molybdenum wafer surface with high energy density, which causes the material to evaporate rapidly and creates precise holes or cutting edges with virtually no thermal damage or material deformation.

In addition, molybdenum laser perforation allows very complex hole types and shapes to be realised. Whereas the realisation of certain special shapes of holes can be difficult in conventional processes, laser perforation can be achieved with ease. Round, square, oval and even more complex hole shapes can be realised in a wide range of materials by means of the high energy and precise control of the laser beam.

This process has the following features and advantages:

1, very short pulse: femtosecond laser pulse width is extremely short, usually in the order of femtoseconds (10 ^ - 15 seconds), the energy density is very high, can be in nanoseconds time will be a small area of the surface of the material heated to a very high temperature, while the overall almost no heat-affected area.

2、Precise control: The focus position, pulse energy and scanning path of femtosecond laser can be precisely controlled to achieve precise processing of tiny holes and complex structures on ultra-thin molybdenum sheets.

Avoid thermal damage: Due to the extremely short processing time, femtosecond laser processing almost does not produce heat conduction or heat-affected areas, effectively avoiding thermal damage and deformation of the material, especially suitable for processing heat-sensitive materials such as ultra-thin molybdenum sheet.

4, high precision and complex structure: able to achieve micron or even sub-micron level fine processing on the surface of ultra-thin molybdenum sheet, including micro-holes, micro-grooves and complex geometrical shapes of cutting, to ensure the accuracy and consistency of the processing results.

Femtosecond laser cutting and drilling technology on ultra-thin molybdenum sheet not only improves the processing efficiency and quality, but also promotes the technological progress and application expansion in the field of micro-nano-processing.