Relying on disruptive femtosecond laser technology, we provide full-cycle technical support from process design to equipment selection and optimization, overcoming micro-nano processing challenges in the mould industry and empowering high-end mould upgrades.
· Capability: Precision etching of complex micro-structures (micro-bosses, hexagons, grooves) on rollers.
· key features: No thermal diffusion (no material deformation), compatible with metals/ceramics/composites, durable for long-term use.
· breakthrough: 10:1 depth-to-diameter microholes (Ra < 0.2μm, no secondary polishing).
· efficiency: Tens-of-seconds per hole, boosting cooling channel/filter element production consistency.
· precision: Submicron structures (grooves, crescents, prisms) with no molten residue, high surface finish.
· outcome: Ensures uniform light efficiency for optical components, supports high-end product upgrades.
· biosecurity & precision: Submicron patterns with zero thermal damage (stable material performance).
· flexibility: Rapid customization/iteration for medical aesthetics (personalized beauty products).
1. Ultra-Short Pulse & Non-Thermal Damage Characteristics：Femtosecond lasers act on materials with ultra-short pulses (10⁻¹⁵ second scale), concentrating energy at the submicron level to achieve zero thermal diffusion. This avoids material deformation, annealing, and performance degradation caused by high temperatures in traditional processing, making it particularly suitable for micro-nano structure machining of precision molds.
2. Nanometer-Level Processing Precision Control：Using high-stability laser sources and precision servo systems, the positioning accuracy reaches ±1μm, enabling submicron-level etching depth and hole diameter processing to meet the high-precision forming requirements of mold surface microstructures.
3. Diverse Material Compatibility：Compatible with metals (tungsten steel, titanium alloys), ceramics (alumina), glass, polymer films (PI/PET), and composite materials, it eliminates the need to adjust processing techniques for material properties, significantly expanding the application range of mold substrates.
• One-Step Forming of Complex Structures：Supports direct machining of complex geometries such as 3D shaped holes (inclined holes, helical holes, film cooling holes) and micro-nano arrays (micro-bosses, grooves, prism structures), with a maximum depth-to-diameter ratio of 10:1. This breaks through the depth-to-diameter ratio limitations and multi-process bottlenecks of traditional mechanical processing.
• High-Quality Surfaces Without Post-Processing：The processed surface has no molten residue or recast layer, with roughness Ra < 0.2μm (etching) to Ra < 0.4μm (cutting). It eliminates the need for secondary polishing or cleaning, directly meeting the strict surface finish requirements of optical and medical molds.
• Efficient Flexible Manufacturing：The single-hole processing cycle is reduced to tens of seconds, and the stitching accuracy for large-format processing (>350mm×350mm) is ≤1μm. It supports rapid iteration and personalized customization of complex patterns, adapting to the flexible production needs of small batches and multiple varieties in the mold industry.
• Cross-Scale Processing Adaptability：Ranging from submicron-scale microholes to millimeter-scale structures (2mm thickness), it can both complete submicron-scale pattern engraving for contact lens molds and achieve efficient drilling of cooling channels for injection molds, meeting the "micro-nano to macro" integrated processing needs of the mold industry.
