● Tungsten/Molybdenum Diaphragm & Slit Diaphragm Machining: Performs fine cutting and drilling on high-hardness tungsten and molybdenum diaphragms and slit diaphragms, ensuring dimensional accuracy and edge quality of optical components to meet stringent requirements of high-end optical systems.
● Beryllium-Copper Probe Machining: Conducts high-precision etching and forming on beryllium-copper probes to guarantee electrical conductivity and structural stability, adapted to precision applications such as semiconductor testing and electronic measurement.
● PI/PET Blind Hole, Through Hole & Dense Hole Machining: Accurately creates blind holes, through holes, and dense hole arrays on polymer films like PI (polyimide) and PET, providing critical processing support for flexible electronics, battery separators, filter membranes, and other products.
● Silicon-Based Drilling, Grooving & Etching: Delivers high-precision drilling, grooving, and etching on silicon-based materials to meet precision manufacturing needs in microelectronics fields such as semiconductor chips, sensors, and micro-electro-mechanical systems (MEMS).
